<\/p>\n
\u201cAmalan Bengkel Mekanikal\u201d, Module for vocational \/ technical course, Technical High School, Malaysia, Dewan Bahasa dan Pustaka, DBP, 2005.<\/p>\n
\u201cStrength of Materials and Materials Science,\u201d Module for Open University Malaysia (OUM), UNITEM Sdn. Bhd., Januari 2006.<\/p>\n
\u201cAspect of Modeling the Mechanics of Solder\/Intermetallic Interface Fracture Process in Solder Interconnects,\u201d M.N. Tamin and N. Kamsah, in\u00a0Advances in Applied Numerical Methods<\/u>, N.M. Ghazali and N.A.C. Sidik (eds.), Penerbit UTM, 2007.<\/p>\n
Damage and Fracture of Composite Materials and Structures, M.N. Tamin, Ed., Springer, 2012, (ISBN 978-3-642-23658-7):
\nChapter 6 \u2013 \u201cEvolution Characteristics of Delamination Damage in CFRP Composites under Transverse Loading,\u201d S.S.R. Koloor, A. Abdul-Latif, X.J. Gong and M.N. Tamin.
\nChapter 9- \u201cMoisture Absorption Effects on the Resistance to Interlaminar Fracture of Woven Glass\/Epoxy Composites Laminates,\u201d X.J. Gong, K.J. Wong and M.N. Tamin.<\/p>\n
\u201cFatigue Fracture Process of Lead-Free Solder Joints in BGA Package,\u201d M.N. Tamin and N.M. Shaffiar, in\u00a0Recent Trends in Fracture Mechanics<\/u>, Y. Prawoto, Ed., NOVA, 2012, (ISNB 978-1-61470-615-1)<\/p>\n","protected":false},"excerpt":{"rendered":"
\u201cAmalan Bengkel Mekanikal\u201d, Module for vocational \/ technical course, Technical High School, Malaysia, Dewan Bahasa dan Pustaka, DBP, 2005. \u201cStrength of Materials and Materials Science,\u201d Module for Open University Malaysia (OUM), UNITEM Sdn. Bhd., Januari 2006. \u201cAspect of Modeling the Mechanics of Solder\/Intermetallic Interface Fracture Process in Solder Interconnects,\u201d M.N. Tamin and N. Kamsah, … Continue reading Books and Book Chapters<\/span><\/a><\/p>\n","protected":false},"author":25,"featured_media":0,"parent":0,"menu_order":0,"comment_status":"closed","ping_status":"open","template":"","meta":{"footnotes":""},"class_list":["post-503","page","type-page","status-publish","hentry"],"rttpg_featured_image_url":null,"rttpg_author":{"display_name":"taminmn","author_link":"https:\/\/mech.utm.my\/taminmn\/author\/taminmn\/"},"rttpg_comment":0,"rttpg_category":false,"rttpg_excerpt":" \u201cAmalan Bengkel Mekanikal\u201d, Module for vocational \/ technical course, Technical High School, Malaysia, Dewan Bahasa dan Pustaka, DBP, 2005. \u201cStrength of Materials and Materials Science,\u201d Module for Open University Malaysia (OUM), UNITEM Sdn. Bhd., Januari 2006. \u201cAspect of Modeling the Mechanics of Solder\/Intermetallic Interface Fracture Process in Solder Interconnects,\u201d M.N. Tamin and N. Kamsah,…","_links":{"self":[{"href":"https:\/\/mech.utm.my\/taminmn\/wp-json\/wp\/v2\/pages\/503","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/mech.utm.my\/taminmn\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/mech.utm.my\/taminmn\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/mech.utm.my\/taminmn\/wp-json\/wp\/v2\/users\/25"}],"replies":[{"embeddable":true,"href":"https:\/\/mech.utm.my\/taminmn\/wp-json\/wp\/v2\/comments?post=503"}],"version-history":[{"count":1,"href":"https:\/\/mech.utm.my\/taminmn\/wp-json\/wp\/v2\/pages\/503\/revisions"}],"predecessor-version":[{"id":504,"href":"https:\/\/mech.utm.my\/taminmn\/wp-json\/wp\/v2\/pages\/503\/revisions\/504"}],"wp:attachment":[{"href":"https:\/\/mech.utm.my\/taminmn\/wp-json\/wp\/v2\/media?parent=503"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}