{"id":68,"date":"2015-05-24T06:27:12","date_gmt":"2015-05-24T06:27:12","guid":{"rendered":"http:\/\/comp.utm.my\/azman\/?page_id=68"},"modified":"2017-09-12T12:05:15","modified_gmt":"2017-09-12T04:05:15","slug":"field3","status":"publish","type":"page","link":"https:\/\/mech.utm.my\/taminmn\/field3\/","title":{"rendered":"Reliability of Microelectronic Components \/ Computational Solid Mechanics"},"content":{"rendered":"<p><strong><em><span style=\"color: #800000\">Projects:<\/span><\/em><\/strong><\/p>\n<p style=\"padding-left: 30px\">1. Deformation Characteristics of Flip Chips Due to Thermal Cycling<\/p>\n<p style=\"padding-left: 30px\">2. Thermal Resistance of Interface Materials for Electronic Applications<br \/>\nDuration: 2001 &#8211; 2003 \u2013 INTEL Collaboration<br \/>\nRole: Project Leader<\/p>\n<p style=\"padding-left: 30px\">3. Studies of Thermal Shock Stress to Electronic Packaging Failures<br \/>\nDuration: 2003-2005 \u2013 INTEL Fellowship Grant<br \/>\nRole: Project Leader &#8211; Fellowship Project Supervisor<\/p>\n<p style=\"padding-left: 30px\">4. Methodology for Assessment of Plastic\/Organic Package Failure Under<br \/>\nThermo-mechanical Loading Conditions<br \/>\nDuration: 2003-2005 \u2013 INTEL Research Grant<br \/>\nRole: Project Leader<\/p>\n<p style=\"padding-left: 30px\">5. Low CTE Substrate to Improve Warp and Solder Joint Reliability<br \/>\n(Intel-UTM-USM collaboration)<br \/>\nDuration: 2003-2005 \u2013 INTEL Research Grant<br \/>\nRole: Project Leader<\/p>\n<p style=\"padding-left: 30px\">6. Predictive Methodology for Crack Initiation and Propagation in Interconnect<br \/>\nMaterials<br \/>\nDuration: 2005-2007 \u2013 INTEL Research Grant<br \/>\nRole: Project Leader<\/p>\n<p style=\"padding-left: 30px\">7. A New Technique for Predicting Damage in Advanced Interconnect Materials for Microelectronic Applications<br \/>\nDuration: 2007-2009 &#8211; eScienceFund<br \/>\nRole: Project Leader 4<\/p>\n<p style=\"padding-left: 30px\">8. Evaluation of Fracture Mechanics-based Model for Lead-free Solder<br \/>\nInterconnects<br \/>\nDuration: 2007-2009 \u2013 INTEL Research Grant<br \/>\nRole: Project Leader<\/p>\n<p style=\"padding-left: 30px\">9. Microstructure-Based Cohesive Damage Model for Fatigue of Solder<br \/>\nInterconnects<br \/>\nDuration: 2009-2011 \u2013 INTEL Research Grant<br \/>\nRole: Project Leader<\/p>\n<p style=\"padding-left: 30px\">10. Simulation of Low Cycle Fatigue Behavior of Pb-free Solder Interconnects<br \/>\nusing Cohesive Zone Model<br \/>\nDuration: 2009-2011 &#8211; INTEL Fellowship Grant<br \/>\nRole: Project Leader &#8211; Fellowship Project Supervisor<\/p>\n<p style=\"padding-left: 30px\">11. Temperature and Rate Dependent Parameters for Damage-based Fatigue<br \/>\nModels of Pb-free Solders<br \/>\nDuration: 2011-2013 &#8211; INTEL Innovation Grant (on-going)<br \/>\nRole: Project Leader<\/p>\n","protected":false},"excerpt":{"rendered":"<p>Projects: 1. Deformation Characteristics of Flip Chips Due to Thermal Cycling 2. Thermal Resistance of Interface Materials for Electronic Applications Duration: 2001 &#8211; 2003 \u2013 INTEL Collaboration Role: Project Leader 3. Studies of Thermal Shock Stress to Electronic Packaging Failures Duration: 2003-2005 \u2013 INTEL Fellowship Grant Role: Project Leader &#8211; Fellowship Project Supervisor 4. Methodology &hellip; <a href=\"https:\/\/mech.utm.my\/taminmn\/field3\/\" class=\"more-link\">Continue reading <span class=\"screen-reader-text\">Reliability of Microelectronic Components \/ Computational Solid Mechanics<\/span><\/a><\/p>\n","protected":false},"author":25,"featured_media":0,"parent":0,"menu_order":0,"comment_status":"closed","ping_status":"open","template":"","meta":{"footnotes":""},"class_list":["post-68","page","type-page","status-publish","hentry"],"rttpg_featured_image_url":null,"rttpg_author":{"display_name":"taminmn","author_link":"https:\/\/mech.utm.my\/taminmn\/author\/taminmn\/"},"rttpg_comment":0,"rttpg_category":false,"rttpg_excerpt":"Projects: 1. Deformation Characteristics of Flip Chips Due to Thermal Cycling 2. Thermal Resistance of Interface Materials for Electronic Applications Duration: 2001 &#8211; 2003 \u2013 INTEL Collaboration Role: Project Leader 3. Studies of Thermal Shock Stress to Electronic Packaging Failures Duration: 2003-2005 \u2013 INTEL Fellowship Grant Role: Project Leader &#8211; Fellowship Project Supervisor 4. Methodology&hellip;","_links":{"self":[{"href":"https:\/\/mech.utm.my\/taminmn\/wp-json\/wp\/v2\/pages\/68","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/mech.utm.my\/taminmn\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/mech.utm.my\/taminmn\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/mech.utm.my\/taminmn\/wp-json\/wp\/v2\/users\/25"}],"replies":[{"embeddable":true,"href":"https:\/\/mech.utm.my\/taminmn\/wp-json\/wp\/v2\/comments?post=68"}],"version-history":[{"count":2,"href":"https:\/\/mech.utm.my\/taminmn\/wp-json\/wp\/v2\/pages\/68\/revisions"}],"predecessor-version":[{"id":534,"href":"https:\/\/mech.utm.my\/taminmn\/wp-json\/wp\/v2\/pages\/68\/revisions\/534"}],"wp:attachment":[{"href":"https:\/\/mech.utm.my\/taminmn\/wp-json\/wp\/v2\/media?parent=68"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}